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Position: Home > Articles > Processes of Self-bonding Corkboard Journal of Northwest Forestry University 2013,28 (6) 178-181

软木无胶胶合工艺研究

作  者:
武再彦;邱增处;任博文;郑超
单  位:
西北农林科技大学机械与电子工程学院
关键词:
软木;无胶胶合;热压工艺
摘  要:
以探索新型环保的无胶软木产品为目的,在现有软木材料性质、结构的研究及木质材料自粘胶合理论基础之上,以热压时间、含水率、热压温度、配坯密度为因素,采用正交试验法进行软木无胶胶合工艺的研究。结果表明:软木材料可在一定条件下自粘合成板,且制成的无胶软木板性能优良。在实验条件下得到的较优软木无胶胶合工艺参数为:热压温度140℃,含水率12%,热压时间5min,配坯密度0.7g·cm-3。
译  名:
Processes of Self-bonding Corkboard
作  者:
WU Zai-yan;QIU Zeng-chu;REN Bo-wen;ZHENG Chao;College of Mechanical and Electronic Engineering,Northwest A&F University;
关键词:
cork;;self-bonding;;hot-pressing process
摘  要:
In order to explorer a new environmental friendly product of self-bonding cork,the process to produce the self-bonding cork board was investigated by the orthogonal test.This research was based on the study of the cork's properties and the woody material self-bonding theory and four factors were examined such as hot-pressing time,moisture content,hot-pressing temperature,and the green density.According to the explosive experiment and the orthogonal test,we got good performance self-bonding cork boards and the optimum parameters were determined as:hot pressing at 140℃,moisture content of 12%,duration of 5minutes and green density of 0.7g·cm-3.

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