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Position: Home > Articles > Study on the Stabilizing Technology of Chemical Plating by Using Uncrystallized Ni-P Plating Bath Journal of Beijing Agricultuer Engineering University 1993 (2) 99-103

镍磷非晶态化学镀的稳定工艺

作  者:
胡三媛;吕广庶
单  位:
北京理工大学;北京工业工程大学农业机械工程系
关键词:
化学镀;非晶镀层;稳定工艺
摘  要:
对采用氯化镍和次亚磷酸钠为主要成分的镀液,在温度及 pH 值不同的条件下获得的镀层进行了沉积速度、含磷量和硬度的测试,并用电镜观察、能谱分析等手段对镀层的组织结构进行了研究。结果表明,所获得的镀层为含磷13.5%的非晶态结构,未经热处理的硬度为 HV400,热处理后可提高到 HV1000。同时获得了镀层厚度与施镀时间的定量关系式。
译  名:
Study on the Stabilizing Technology of Chemical Plating by Using Uncrystallized Ni-P Plating Bath
作  者:
Hu Sanyuan (Department of Agricultural Machinery Engineering)Lü Guangshu (Beijing Institute of Technology)
关键词:
chemical plating;;uncrystallized plating layer;;stabilizing technology
摘  要:
The NiCl_2 and NaH_2PO_2 are used as the main composition of the chemical plating bath.The chemical plating layers obtained at different temperature and pH values are mea- sured with respect to the deposit speeds,the phosphorus content and the hardnees of the sam- ples.The microscopical structures of the chemical plating are studied by using electronmi- croscope and energy spectrum instruments.The result indicates that the plating layer is an uncrystallized structure with phosphorus content of 13.5%,and the hardness of the plating layer is HV400 before heat-treatment,HV1 000 after heat-treatment.The quantitative rela- tions between plating thickness and the period of plating time are obtained.

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