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Position: Home > Articles > Numerical analysis and study on transient heat transmit process of nano copper film Journal of Northeast Agricultural University 2015,46 (6) 93-98

纳米铜薄膜瞬态热输运过程试验研究与数值模拟分析

作  者:
韩亚萍;曾凡达;吴江
单  位:
东北林业大学理学院
关键词:
磁控溅射;纳米铜薄膜;飞秒瞬态热反射技术;双温模型;热输运过程;电声耦合系数
摘  要:
利用磁控溅射法制备厚度100 nm的铜薄膜,使用800 nm泵浦和400 nm探测瞬态反射技术,测量铜薄膜的时间分辨反射率,分析铜薄膜在飞秒激光作用下瞬态热输运过程。利用双温模型对铜薄膜热输运过程进行数值模拟,模拟结果显示电子和晶格体系温度变化过程,电声耦合系数为1.2×1016W·m-3K。变换参数进行模拟,分析薄膜厚度和电声耦合系数对非平衡热输运过程影响规律,为铜薄膜在集成电路中应用提供参考。
译  名:
Numerical analysis and study on transient heat transmit process of nano copper film
作  者:
HAN Yaping;ZENG Fanda;WU Jiang;School of Science, Northeast Forestry University;
关键词:
magnetron sputtering;;nano copper film;;femtosecond transient reflection technique;;Two-Temperature model;;heat transmit;;electron-phonon coupling coefficient
摘  要:
Using the magnetron sputtering method to prepare the copper film, we got a copper film with thickness of 100 nm. Using transient reflectivity technique of 800 nm-pump and 400 nm-probe to measure the reflectivity change of copper film, we analysis the transient of copper film with the action of femtosencond laser pulse. Numerically simulating the heat transient transmit of copper film with TwoTemperature Model, the result showed that temperature change electron and lattice system. The electron-phonon coupling coefficient is calculated to be 1.2×1016W· m- 3K. Changing parameters, the influence of film thickness and electron- phonon coupling coefficient choosing to the unbalanced heat transmit process is analyzed.

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